Duration
5 days
Overview
MSSB’s 5-day Wafer Fab Processing training programme provides basic but powerful information about the intricate semiconductor manufacturing process. Additional hands-on training in each process module helps in developing the technical skills of the participants.
Learning Outcomes
Upon completion of the training programme, participants should be able to:
- Understand the basic semiconductor wafer processing steps in each process modules: diffusion, thin film, lithography and etch.
- Learn the fundamentals of each processing step and the reason it is use in the industry today.
- Understand the evolution of each processing techniques, previous and current generation IC’s.
- Understand the basic processes of a CMOS device (from device level until back end processes).
Methodology
This course will utilize a combination of lecture and practical/hands-on lessons in cleanroom.
Target Group
Managers, engineers, and technicians working in the semiconductor industry, undergraduates/post-graduates students in related filed.
Pre-requisite
Foundation in physics
Day 1:
- Safety and Hazard in Wafer Fabrication
- Introduction to IC Design
- Introduction to Semiconductor Materials and Devices
Day 2: Process theory
- Process Integration
- Wafer Fabrication Technology Overview
- Process Modules
- Thin Film
- Diffusion
- Lithography
- Dry Etching
- Fabrication Process Flow
Day 3: Process Module
- Basic cleanroom protocol and safety includes gowning/de-gowning
- Diffusion processes
- Thin film processes
Day 4: Process Module
- Photo-lithography processes
- Etching processes
Day 5: Wafer Level Testing
- Introduction of Semiconductor Electrical Testing
- Discrete Device Testing & Auto DC Parametric - Agilent 4080 Tester & B1500 IV Tester
- Analog and Power Device Tester – LTXC ASL1000 Tester
- Functional Mixed Signal Tester – LTXC D10 Tester
Programme scope, delivery arrangements and suitability are confirmed during enquiry.