EIEIOTECHNOVATION
← Training programmes

EIEIO / AUTOMATION & EMERGING TECHNOLOGY

Managing & Improving Reliability within Electronics Product Design

Course outline

2 days

Duration

2 days

Overview

What could an unreliable product really cost your company?

Your credibility?

Your reputation?

Your future?

Markets are demanding cheaper, more reliable electronic products and systems and many manufacturers find that traditional, established procedures and processes. Yet in today’s market-driven climate you need, even more, to review procedures, examine options and pursue cost-effective solutions that will allow you to stay competitive and profitable, and increase your market credibility.

Reliability enhancement is now within everyone’s reach

Leading-edge reliability enhancement technologies used to be regarded as solely the province of safety-critical avionics and aerospace applications.

But things change. These technologies are now within the grasp of all electronic designers and manufacturers; crucially the benefits in reliability that they bring are now expected by the market are now being questioned.

The idea of running months of extensive reliability testing is fast becoming a luxury – and one that few can justify.

Global customers seek out suppliers whose enhanced reliability performance improves their own market penetration and consolidates their own position – the rewards are substantial for those suppliers ready to meet the new demands.

These 2 days masterclass will have a good balance of Practical and theory. Initial theory to set the scene goes quickly into multiple case studies so participants learn quickly how to do similar on their own product types.

Attend this course to Master:

  • Understand how to develop Unique and Effective Low Cost Accelerated Stress Test programmes.
  • Predict Reliability from Accelerated Testing.
  • Understand how to focus on Early Life Reliability Testing and Improvement to drive Customer Satisfaction improvement.
  • Realizing the need to develop unique Reliability Test programmes as opposed to following old ineffective Military Standards for Reliability Testing.
  • How to set up a World Class Reliability Test approach to suit all product types.
  • Changing company culture from Retrospective to Predictive.
  • Giving engineers and management the ability to control and predict Process Reliability.
  • Learn how to improve and manage Design Quality.

CASE STUDIES & PAST PARTICIPANTS ACHIEVEMENT:

  • Realize how world class companies manage Reliability and make major cost savings in Field Failure costs.
  • Understand how to make your Accelerated Testing most efficient and low cost.
  • Making Reliability Testing much more effective and NOT generic according to Military Std specs which many companies follow due to lack of knowledge.
  • Realizing the need for making Accelerated Testing unique to the product type to maximise effectiveness.
  • Ability to drive 50% REDUCTION in Field Failures within 12-18 months once a new and effective low cost programme set up.

Audience

The Course is designed to:

  • Reliability engineers
  • Test engineers
  • NPI engineer / Manager (New Product)
  • R&D engineers.
  • Research Team.
  • Electronic and electro mechanical designers / manufacturers
  • Quality Assurance/Quality Lab/Departments.
  • Design Team.
  • Manufacturing
  • Design reliability section.
  • Electronic Team.
  • Testing companies provides reliability stress testing.
  • Anyone who is doing reliability testing at design stage.
  • Contract manufacturers - There remains a need to understand reliability to add value to the service being provided to the client. This knowledge would be a big advantage for doing in-house. By in-house mean, they benefit from being able to analyse their test data themselves. Analysis of test data and being able to discuss results in more professional manner.

Agenda

DAY 1 (AM Agenda)

Understanding Basic Reliability

  • Application of Bathtub Curve theory
  • Importance of Early Life Reliability and the Importance of Exponential and Normal Distributions in Reliability Prediction
  • Definition of Hazard Rate and its importance in Reliability estimation at RD stage

Understanding MTTF and effect on Product Level Fail Rates

  • Realising the Importance of Component Reliability and MTTF spec
  • Combining different MTTF levels for Different Components / Sub-Assemblies

Accelerated Stress Testing and effect of Activation Energy

  • Real Life examples of how to calculate Activation Energy level from experimental
  • work at Product and Component level

Understand Accelerated Testing to set up Predictive Testing Models for all products at RD stage

  • High Temp Arrhenius model and Activation Energies used for key component failure modes
  • Maximising Acceleration Factors by combining Temperature, Thermal Cycling, Power Cycling and Humidity

Semiconductor Defect Types Review

  • Summary of defect types and types of Reliability Tests that are most effective in stimulating Latent Semicon defects

Day 1 (PM Agenda)

Brainstorming session to define most effective Sequential Stress Test programme for packaged device reliability evaluation

  • How to develop matrix of stress test types to apply and comparison with JEDEC

Statistics involved in Reliability Estimation and Decision Making

Evaluating the effectiveness of different stress test types with the Hughes Test Strength Equation

  • Developing an Effective Reliability test Strategy , using Modern stress techniques, including Random Vibration and Thermal Cycling
  • Product Level Case Study with real life examples

Relationship of Manufacturing Yield with Early Life Failure Rate

  • Component Level prediction from Yield data
  • Using yield performance data from Board and Assembly processes to Predict Warranty Field Fail Rates
  • How to predict and control Early Life Fails using manufacturing data

Day 2 (AM Agenda)

Life Test Planning

  • Setting up most effective Design Quality Life Testing to evaluate Design Reliability and using the appropriate Stress Model to maximise defect detection
  • Predicting MTTF from reduced Sample Sizes

Sub-Assy Reliability Stress Testing

  • Making Reliability more effective at Sub-Assy level
  • How to Accelerate Failures by stress testing Control boards, Power boards,
  • Combining Rel predictions of different Sub-Assemblies to make Total product
  • Understanding stresses involved at board level and how to simulate at packaged device level

Weibull Analysis of Failure data and how to apply to any product failure data

Applying DOE using Fractional Factorial techniques to maximise effect of Stress Test with reduced samples

  • Developing best mix of Stress Testing for a Packaged Device

Day 2 (PM Agenda)

Setting up strong Design Quality Test Programme and using Design Maturity Measurement to measure Design Capability

  • High Design Maturity controls Design Reliability
  • Workshop to define methodology for Packaged Device Design Quality Testing

Predicting Field fail Rates using development test Information from a Design Quality Engineering Test programme

  • Combining Mil-217 predictions and using Design Maturity Ratings to form an efficient model

Setting up New Product Introduction scoring model to deliver strongest Design Quality into Mass Production to maximise Reliability

Workshop / General Q&A

Programme scope, delivery arrangements and suitability are confirmed during enquiry.